From Sand to Chip – A Beginner's Journey into the World of Semiconductors

This Course Includes

• 2.5 hours of on-demand video lessons

• Lifetime access via mobile, tablet, and TV

• Certificate of Completion upon finishing the course

📌 Lecture Breakdown

1. Course Introduction

2. Semiconductor Materials – Basic Concepts

3. What Are Silicon Chips?

4. Silicon Wafer Preparation

5. Cleanroom Environment

6. Photolithography Process

7. Etching Techniques

8. Doping Methods

9. Additional Fabrication Processes

10. Assembly & Packaging

11. Example: Transistor Fabrication

12. Example: Chip Assembly Process

What You’ll Learn

• Get a comprehensive overview of how semiconductor chips are manufactured.

• Understand the fundamental processes used in chip fabrication.

• Explore the global semiconductor supply chain and its key components.

• Learn about essential technical skills required to enter or transition into the semiconductor industry.

This Course Overview

• This introductory course takes you behind the scenes of the most advanced technology in the world—semiconductors. Learn how simple sand transforms into a powerful microchip through a series of high-precision processes like photolithography, doping, and etching.

  With real-world examples and step-by-step explanations, you’ll gain a solid foundation in how semiconductors are made and how they power our everyday devices—from smartphones to satellites.

Introduction to Semiconductor Manufacturing

This Course Includes

• 9 Modules

• Lifetime access via mobile and Laptop

• Certificate of Completion upon finishing the course

📌 Lecture Breakdown

1. Semiconductor process and Overview: MOSFET

2. CMOS Process Integration

3. Cleanroom, RCA Cleaning Crystal Growth

4. Diffusion: Drive-in, Rapid Thermal Anneal, Flash Lamp Anneal, Diffusion

5. Diffusion Equation, Predep & Drive-in, PN Junction by Predep & Drive

6. Oxidation

7. Ion Implantation and Implantation Mask

8. Photolithography, Light Source and Stepper & Alignment

9. EUV Lithography

What You’ll Learn

• Simulation and Simulation Software

• Manufacturing Processes

• Electronic Systems

• Semiconductors

• Process Control

• Process Engineering

• Electronics

This Course Overview

• This course provides a foundational understanding of how semiconductors are designed, fabricated, tested, and packaged for use in modern electronic devices. Learners will explore the complete journey from raw silicon to functional semiconductor chips, gaining insights into key manufacturing steps and the critical role semiconductors play in technologies such as smartphones, computers, and renewable energy systems.

  Whether you're a student, engineer, or professional new to the field, this course will demystify the semiconductor fabrication process and introduce you to the technologies shaping the future of electronics.

Introduction to Semiconductor Process

This Course Includes

• Duration: 6–8 weeks

• Mode: Online / On-site / Hybrid

• Includes: Lectures, simulations, problem-solving sessions, quizzes

• Prerequisites: High school physics and basic calculus

• Certificate: Provided upon successful completion

📌 Lecture Breakdown

Module 1: Atomic Structure and Bonding in Solids
Module 2: Crystal Structure and Classification of Materials
Module 3: Energy Bands and Carrier Statistics
Module 4: Intrinsic and Extrinsic Semiconductors
Module 5: Carrier Transport – Drift and Diffusion
Module 6: Generation, Recombination, and Carrier Lifetime
Module 7: PN Junctions and Depletion Region Physics
Module 8: Diode Characteristics and Biasing
Module 9: Bipolar Junction Transistors (BJTs)
Module 10: Introduction to MOSFETs and Device Scaling

What You’ll Learn

• Understand the energy band structures and their significance in electric properties of solids

• Analyze the carrier statistics in semiconductors

• Analyze the carrier dynamics and the resulting conduction properties of semiconductors

This Course Overview

• This course introduces the fundamental principles of semiconductor materials and devices. It covers the physical behavior of semiconductors at the atomic and electronic level and explains how these principles are applied in real-world electronic components. Through a combination of theory, problem-solving, and simulations, learners will explore intrinsic and extrinsic materials, carrier dynamics, energy bands, junction formation, and basic device operations (diodes, BJTs, and MOSFETs).

  The course is designed for undergraduate and diploma-level engineering students, researchers, and professionals interested in entering the semiconductor, electronics, or nanotechnology industries.

Semiconductor Physics

This Course Includes

• 6 to 10 weeks (depending on depth and delivery format)

• In-person / Online / Hybrid

• Includes live lectures, virtual labs or lab demonstrations, and assignments

📌 Lecture Breakdown

• Module 1: Introduction to Semiconductor Materials and the Need for Characterization
  Module 2: Electrical Characterization

  • Four-point probe resistivity measurement

  • Hall Effect measurement

  • C-V profiling of PN junctions and MOS capacitors

  Module 3: Structural & Morphological Analysis

  • X-Ray Diffraction (XRD)

  • Scanning Electron Microscopy (SEM)

  • Atomic Force Microscopy (AFM)

  Module 4: Optical Characterization

  • UV-Vis and IR spectroscopy

  • Photoluminescence (PL)

  • Ellipsometry

  Module 5: Surface & Interface Characterization

  • Secondary Ion Mass Spectrometry (SIMS)

  • X-ray Photoelectron Spectroscopy (XPS)

  • Auger Electron Spectroscopy (AES)

  Module 6: Reliability and Defect Analysis

  • Deep-Level Transient Spectroscopy (DLTS)

  • Thermal wave analysis

  • Time-resolved photoluminescence

What You’ll Learn

• ✅ Understand the need for semiconductor material and device characterization
  ✅ Describe common electrical, optical, structural, and surface characterization techniques
  ✅ Select appropriate tools and methods for analyzing semiconductor samples
  ✅ Interpret data from real-world characterization instruments
  ✅ Assess material quality, doping levels, carrier mobility, and device reliability
  ✅ Apply characterization techniques in research and industrial settings

This Course Overview

• This course provides a comprehensive understanding of the methods and tools used to analyze and evaluate the electrical, structural, chemical, and optical properties of semiconductor materials and devices. Students will explore both theoretical concepts and practical techniques that are essential for quality control, research, and device fabrication in the semiconductor industry.

  Through case studies and hands-on labs or simulations, learners will gain exposure to characterization instruments such as Scanning Electron Microscopes (SEM), Atomic Force Microscopes (AFM), Four-Point Probes, Hall Effect systems, X-Ray Diffraction (XRD), and more.

Fundamentals of Semiconductor Characterization

This Course Includes

• 8 to 10 weeks (can be customized into short-term intensive training modules)

• Online / In-person / Hybrid

• Includes live lectures, case studies, packaging design labs, and industry talks

📌 Lecture Breakdown

Module 1: Introduction to Semiconductor Packaging

• Role of packaging in the semiconductor value chain

• Packaging vs. assembly vs. testing

Module 2: Types of Packages and Interconnection Technologies

• Wire bonding, flip chip, through-silicon via (TSV)

• Package-on-package (PoP), System-in-Package (SiP), Fan-in/Fan-out WLP

Module 3: Materials in Semiconductor Packaging

• Substrates, die attach, underfill, encapsulants

• Material selection for thermal/electrical performance

Module 4: Design and Simulation of IC Packages

• Package parasitics (RLC), thermal modeling

• Introduction to packaging design tools (e.g., Cadence SIP, ANSYS)

Module 5: Reliability, Testing & Failure Analysis

• Moisture sensitivity, thermal cycling, delamination

• Testing methods and JEDEC standards

Module 6: Advanced Packaging Technologies and Trends

• 2.5D/3D stacking, chiplet architecture

• Heterogeneous integration and AI hardware packaging

• Sustainable packaging practices

What You’ll Learn

• ✅ Understand the fundamentals and purpose of semiconductor packaging
  ✅ Identify key materials and interconnect technologies used in packaging
  ✅ Analyze thermal, mechanical, and electrical constraints in package design
  ✅ Compare traditional and advanced packaging approaches (e.g., Flip Chip, WLCSP, 3D ICs)
  ✅ Design basic IC packages using industry-standard tools or frameworks
  ✅ Evaluate reliability and failure mechanisms in semiconductor packages

This Course Overview

• This specialized course dives into the critical role of semiconductor packaging in ensuring the performance, reliability, and scalability of integrated circuits (ICs). Students and professionals will gain in-depth knowledge of packaging materials, technologies, design considerations, thermal and mechanical management, and emerging trends such as 2.5D, 3D, and fan-out wafer-level packaging.

  Through a blend of theoretical modules, case studies, and practical design exercises, learners will develop the skills required to work in backend semiconductor operations, advanced packaging R&D, and product integration teams.

Semiconductor Packaging Specialization

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